Power chips are linked to outside circuits with packaging, and their efficiency depends on the support of the product packaging. In high-power situations, power chips are usually packaged as power modules. Chip interconnection refers to the electrical link on the top surface area of the chip, which is generally light weight aluminum bonding wire in standard modules. ^
Traditional power component bundle cross-section
Today, industrial silicon carbide power components still mostly use the product packaging modern technology of this wire-bonded typical silicon IGBT module. They deal with troubles such as huge high-frequency parasitic criteria, inadequate warm dissipation ability, low-temperature resistance, and not enough insulation strength, which limit making use of silicon carbide semiconductors. The display of excellent performance. In order to address these issues and completely manipulate the significant possible benefits of silicon carbide chips, lots of new product packaging technologies and services for silicon carbide power modules have actually emerged in recent times.
Silicon carbide power component bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have established from gold cable bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually created from gold wires to copper cords, and the driving pressure is cost reduction; high-power tools have actually developed from aluminum cables (strips) to Cu Clips, and the driving force is to improve product performance. The better the power, the higher the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that utilizes a solid copper bridge soldered to solder to link chips and pins. Compared with conventional bonding product packaging methods, Cu Clip technology has the complying with advantages:
1. The link in between the chip and the pins is made of copper sheets, which, to a certain level, replaces the typical wire bonding technique in between the chip and the pins. Consequently, a special bundle resistance value, greater current circulation, and far better thermal conductivity can be acquired.
2. The lead pin welding location does not need to be silver-plated, which can fully conserve the cost of silver plating and bad silver plating.
3. The product look is completely constant with typical items and is generally used in web servers, mobile computer systems, batteries/drives, graphics cards, motors, power materials, and other areas.
Cu Clip has 2 bonding methods.
All copper sheet bonding technique
Both the Gate pad and the Source pad are clip-based. This bonding approach is a lot more expensive and intricate, but it can accomplish much better Rdson and much better thermal results.
( copper strip)
Copper sheet plus cord bonding method
The source pad utilizes a Clip technique, and the Gate makes use of a Wire method. This bonding method is a little less expensive than the all-copper bonding method, conserving wafer area (applicable to really tiny entrance areas). The process is less complex than the all-copper bonding approach and can get far better Rdson and much better thermal impact.
Provider of Copper Strip
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